Printed Circuit Assembly Layered Process Audit (LPA)
Form Template
The Printed Circuit Assembly Layered Process Audit (LPA) is an invaluable time saving tool without substitute.
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Machines utilizing laser drilled microvias, cavity boards, heavy copper via-in-pad, microwave & RF boards will need to be audited in a clear manner. The LPA form helps all levels of management and testers get a clear picture of their entire auditing process. Use the form to plan, check and act on a system that can save your organization significant resources,
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“I’m not a tech guy and I was able to pick this thing up in probably an hour, and actually start to build apps. I’ve done them over lunch when I’ve gotten frustrated with a process that didn’t exist in our company. So for non tech people who’ve got a problem, the support here is awesome and I’d recommend it to anybody, not just in our industry.”