Printed Circuit Assembly Layered Process Audit (LPA) Mobile App
Core features are free forever
The Printed Circuit Assembly Layered Process Audit (LPA) is an invaluable time saving tool without substitute.
How does it work?
Machines utilizing laser drilled microvias, cavity boards, heavy copper via-in-pad, microwave & RF boards will need to be audited in a clear manner. The LPA form helps all levels of management and testers get a clear picture of their entire auditing process. Use the form to plan, check and act on a system that can save your organization significant resources,